|
Copper Alloy
Brass Materials
Alloy No.
|
Chemical Compostion |
Features and Application |
| Cu |
Fe |
Pb |
Zn |
Features |
Application |
| C2300 |
84.0-86.0 |
<0.05 |
<0.05 |
REM |
Best Extensibility, punching availability, electric-plating uniformity. |
Electrical appliances, decorative articles, terminal, automobile radiator, camera parts, handicraft items, thermo pot |
| C2600 |
68.5-71.5
|
<0.05 |
<0.05 |
REM |
| C2680 |
64.0-68.0 |
<0.05 |
<0.05 |
REM |
| C2801 |
59.0-62.0 |
<0.07 |
<0.05 |
REM |
Phosphor Bronze Materials
| Alloy No. |
Chemical Compostion |
Features and Application |
| Fe |
Pb |
Zn |
Sn |
P |
Cu+Sn+P |
Features |
Application |
| C5111 |
<0.10 |
<0.05 |
<0.20
|
3.5-5.5 |
<0.03 |
>99.7 |
Best Extensibility, Good Resistance to Fatigue, Good Resistance to Corrosion |
Electronic components, electrical spring, switch, lead wire rack, connector, diaphragm, Bellows , fuse chuck, telecommunication, information, measuring instrument, Relay |
| C5191 |
<0.10 |
<0.05 |
<0.20 |
5.5-7.0 |
0.03-0.35 |
>99.7 |
| C5210 |
<0.10 |
<0.05 |
<0.20 |
7.0-9.0 |
0.03-0.35 |
>99.7 |
| C5210(SP) |
<0.10 |
<0.05 |
<0.20
|
7.0-9.0 |
0.10-0.20 |
>99.7 |
| C5240 |
<0.10 |
<0.05 |
<0.20 |
9.0-11.0 |
0.10-0.20 |
>99.7 |
Copper Materials
| Alloy No. |
Chemical Compostion |
Features and Application |
| Cu |
Fe |
Zn |
P |
Features |
Application |
| C194 |
>97 |
2.35
|
0.12 |
0.07 |
High conductivity, higher strength for using on the lead wire frame. |
A hi-tech product for IC LED and PCB conductive lead wire frame applications. |
| C1100 |
>99.90 |
- |
- |
- |
Satisfactory conductivity, heat transfer, ductility, extrusion performance, corrosion resistance and weathering endurance. |
Electrical appliances, terminals, chemical industry, architectural industry, decorative industry, packing, utensils |
| C1020 |
>99.96 |
- |
- |
- |
High-conductive material for lead wire terminal, heat sinks and transformer coil. |
Nickel Silver Materials
| Alloy No. |
Chemical Compostion |
Features and Application |
| Cu |
Fe |
Pb |
Zn |
NI |
Mg |
Mn |
Co |
Si |
Features |
Application |
| C7521 |
62.0-66.0 |
<0.25 |
<0.1 |
REM |
16.5-19.5 |
- |
0-0.05 |
0-0.05 |
- |
Reliable performance in resisting against corrosion, rusting and heat. Satisfactory spring features. Maintain designed color when exposing to Sn furnace while endurable up to 300℃ of temperature. |
Cell phone, telecommunication electronic product, transistor, relay |
| C7701 |
54.0-58.0 |
<0.25 |
<0.1 |
REM |
16.5-19.5 |
- |
0-0.05 |
0-0.05 |
- |
| C7025 |
Rem |
- |
- |
- |
2.2-4.2 |
0.15 |
- |
- |
0.25-1.2 |
| C7035 |
Rem |
- |
- |
- |
1.5-1.7 |
- |
- |
- |
0.6-0.8 |
Ti Materials
| Alloy No. |
Chemical Compostion |
Features and Application |
| Ti |
Cu |
Features |
Application |
YCuT-FX
|
2.9-3.5
|
>97
|
Reliable performance in resisting against corrosion, rusting and heat. Satisfactory spring features. |
Cell phone, telecommunications electronic products, ultra-thin electronic products |
| YCutT-M |
2.9-3.5 |
>99.90 |
| YCuT-F |
2.9-3.5 |
>99.96 |
BeCu Materials
| Alloy No. |
Chemical Compostion |
Features and Application |
| Cu |
Fe |
NI NI + Co |
NI |
Al |
Mn |
Be |
Si |
Features |
Application |
Alloy 7 /
C17410 |
Rem |
- |
1.8-2.5
|
<0.6 |
- |
0.2-0.4
|
- |
- |
High-conductivity and high spring features are specially required for fatigue-resistant connectors. |
Cell phones, telecommunication electronic products, ultra-thin electronic products. Heat treatment within the required timeline after bending fabrication to enhance fatigue resistance. |
Alloy25 /
C17200(Unheated treatment) |
Rem |
<0.6 |
>0.2 |
- |
- |
1.8-2.0 |
- |
- |
Alloy25HMB /
C17200(Heated treatment) |
Rem |
<0.6 |
>0.2 |
- |
- |
1.8-2.0 |
- |
- |
EFTEC-Series Materials
| Alloy No. |
Chemical Compostion |
Features and Application |
| Cu |
Zn |
Sn |
Mn |
NI |
Ag |
Mg |
Cr |
Si |
Features |
Application |
| EFTEC-45 |
Rem |
0.15-0.25 |
0.10-0.20 |
- |
- |
- |
- |
0.15-0.23 |
- |
Furukawa has developed the high-conductive and high-strength Cu alloy in a specific field. Smaller and thinner consumer electronic products oriented. |
IC/Lead-Frame, Cell phones, telecommunication electronic products, ultra-thin electronic products. Heat treatment within the required timeline after bending fabrication to enhance fatigue resistance. |
| EFTEC-64T/C |
Rem |
0.18-0.26 |
0.23-0.27 |
- |
- |
- |
- |
0.20-0.35 |
0.01-0.04 |
| EFTEC-23Z |
Rem |
0.45-0.65 |
0.50-0.70 |
<0.10 |
2.20-3.20 |
0.02-0.05 |
- |
- |
- |
| EFTEC-97 |
Rem |
0.40-0.55 |
0.10-0.25 |
- |
2.00-2.80 |
- |
0.05-0.20 |
- |
0.45-0.60 |
EFTEC-98S |
Rem |
0.40-0.55 |
0.10-0.25 |
- |
3.40-4.20 |
- |
0.05-0.20 |
0.10-0.50 |
0.85-1.00 |
| EFCUBE-820 |
Rem |
0.40-0.55 |
0.10-0.25 |
- |
2.00-2.50 |
|
0.05-0.20 |
0.10-0.20 |
0.55-0.75 |
EFCUBE-ST |
Rem |
0.40-0.55 |
0.10-0.25 |
- |
3.40-4.20 |
- |
0.05-0.20 |
0.10-0.20 |
0.85-1.25 |
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